Contact Information
No phone number provided.
https://www.semi.org/eu/connect/events/3d-and-systems-summit
No e-mail provided
From
June 12th, 2024
To
June 14th, 2024
SEMI 3D & Systems Summit 2024
Event Information
The SEMI 3D & Systems Summit is a premier event for the 3D packaging roadmap, Heterogeneous Integration, and System-In-Package (SiP) manufacturing industries. Held at the Dresden Hilton Hotel in Dresden, Germany, the summit brings together experts from around the world to discuss the most advanced topics related to high reliability and high performance of disruptive applications like Mobile and IoT.
The summit offers a unique opportunity for exhibitors to showcase their products and services to a global audience, as well as engage in B2B matchmaking and networking. Invited distinguished global industry speakers will provide valuable insights into the industry.
Don't miss out on the chance to be part of the SEMI 3D & Systems Summit. Join the world's leading experts in the 3D packaging roadmap, Heterogeneous Integration, and System-In-Package (SiP) manufacturing industries and be part of the future of disruptive applications.
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Organizer(s)
SEMI - Semiconductor Equipment and Materials International
Available Booths
Location
Hilton Dresden Hotel,
Dresden,
Germany, Germany
Don’t forget to Book your Hotel’s Rooms:
Floor Plan(s)
There is no available floor plan.
Supporting documents (if any)
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Other editions
SEMI 3D & Systems Summit 2020
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The SEMI 3D & Systems Summit 2020 has been recognized as a pivotal event for those invested in the future of 3D packaging and system integration. The summit's agenda has been meticulously crafted to address the most advanced topics in the industry, including the 3D packaging ro...
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The SEMI 3D & Systems Summit is an event designed to bring together the world's leading experts in 3D packaging, Heterogeneous Integration, and System-In-Package (SiP) manufacturing. Held in the beautiful city of Dresden, Germany, the summit will provide an ideal platform for exhibitors, speak...
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