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 November 25th, 2026

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 November 27th, 2026

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Events IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA Nov. 2026

IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA Nov. 2026

The event dates have been confirmed.

Event Information

Electric & Electronics Measurement, Control & Testing

Discover Asia's leading exhibition for IC Final Manufacturing at IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA. This highly anticipated event brings together a wide range of advanced equipment, materials, and services that are essential for the IC packaging industry. Whether you are a manufacturer, supplier, or service provider, this expo offers a unique platform to showcase your products and connect with industry professionals.

At IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA, you will find a comprehensive range of assembly equipment, packaging materials, and equipment, as well as analysis and simulation software specifically designed for IC packaging. This event is the perfect opportunity to stay up-to-date with the latest technological advancements and market trends in the industry.

Join us at IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA and gain valuable insights into the future of IC final manufacturing. Connect with key players in the industry, explore innovative solutions, and establish new business partnerships. Don't miss out on this premier event that brings together the best of the IC packaging industry in one place.

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Contact Information

No phone number provided.

http://www.nepconjapan.jp/hub/ja-jp.html

icp-e@reedexpo.co.jp

Organizer(s)

RX Japan

Available Booths

Location

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Nagoya, Japan, Japan

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Floor Plan(s)

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