The IEEE FLEPS 2023 event has been designed to serve as a premier platform for the exchange of groundbreaking research findings and innovative ideas within the realm of Flexible and Printable Sensors and Systems. This forum attracts a diverse group of research scientists, engineers, and practitioners from around the globe, all eager to share their expertise and insights. The focus is placed on the latest advancements in material printing on flexible and disposable substrates, which have garnered significant interest due to their potential to revolutionize low-cost, large-area electronics and sensing systems.

Emerging technologies such as printing and additive manufacturing have been spotlighted for their role in developing a diverse array of deployable systems, including displays, sensors, and RFID tags. The re-purposing of technologies initially developed for silicon-based planar electronics and solid-state sensors is being explored to meet the growing demands in this dynamic field. The IEEE FLEPS provides an unparalleled opportunity to delve into these innovations, offering a comprehensive overview of current trends and future directions in flexible and printed sensor technology.

With the rapid expansion of the market and the continuous evolution of novel printable and solution-processable nanomaterials, the IEEE FLEPS has been recognized as a crucial event for understanding the trajectory of this burgeoning industry. Participants are invited to engage with the latest printing techniques that have sparked a new wave of sensor technologies and applications. This event is positioned as a vital gathering for those interested in staying at the forefront of flexible and printed sensor advancements, fostering collaboration and knowledge sharing among industry leaders and innovators.