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InterPACK 2025
Event Information
InterPACK is the premier international conference for the exchange of knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Representing the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK is a systems-focused event that covers topics such as Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles.
This international meeting provides a platform for global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. Attendees can look forward to paper presentations and exhibits, panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
InterPACK is the ideal event for those looking to stay up to date with the latest developments in electronics packaging and heterogeneous integration. Attendees will have the opportunity to gain insight into the latest advancements in the field and network with industry professionals from around the world.
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Organizer(s)
The American Society of Mechanical Engineers (ASME)
Available Booths
Location
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United States, United States
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Floor Plan(s)
Supporting documents (if any)
Other editions
InterPACK 2024
InterPACK is the premier international conference to exchange state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK is a system...
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InterPACK 2023
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The premier international conference, InterPACK 2023, has been recognized as a pivotal platform for the dissemination of cutting-edge knowledge in the realms of research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. As the...
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InterPACK 2024
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), this systems-focused ...
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